Event Details

Teledyne Scientific offers an innovative 3D-Heterogenous Integration (3D-HI) Packaging Technology as a foundry process though the CA DREAMS hub. The SMART Laminated Interposer with CMOS (SLIC) technology enables a new generation of transceiver arrays that integrate all required functionality from rf beamforming RFIC electronics to III-V front-end MMICs, low-loss transmission lines, dc power distribution, and aperture feeds into a compact, rugged, micromachined three-dimensional structure. Teledyne’s SLIC 3DHI process is particularly suitable for the fabrication of low-cost batch fabricated millimeter-wave phased arrays and has been used to demonstrate phased arrays operating at 44, 94, and 220 GHz.

May 2, 2025

Join Zoom Meeting
https://usc.zoom.us/j/97017422125?pwd=Dbrt8MNMrmBV3xalKQJcAiNsggFJjJ.1&from=addon
Meeting ID: 970 1742 2125
Passcode: 937624

Host: Steve Crago
POC: Amy Kasmir

Speaker Bio

Jonathan Hacker is a department head at Teledyne Scientific Company, involved in research and development efforts in low-cost batch-fabricated phased-array sensors using 3DHI, Indium phosphide millimeter-wave monolithic microwave integrated circuits, Charge-Enhanced GaN MMICs, and Vanadium Dioxide ultra-low loss RF switches. He received his Ph.D. in Electrical Engineering at Caltech in 1994. Hacker is a Fellow of the IEEE.